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  1 for more information www.linear.com/ltm4636 typical a pplica t ion descrip t ion 40a dc/dc module regulator the lt m ? 4636 is a 40 a step-down module (power module) switching regulator with a stacked inductor as a heat sink for quicker heat dissipation and cooler operation in a small package. the exposed inductor permits direct contact with airflow from any direction. the ltm4636 can deliver 40w (12v in , 1v out , 40a, 200 lfm) with only 40c rise over the ambient temperature. full-power 40w is delivered, up to 83 c ambient and half-power 20 w is supported at 110c ambient. the ltm4636 operates at 92%, 90% and 88% efficiency, delivering 15a, 30 a and 40 a, respectively, to a 1 v load (12v in ). the module regulator is scalable such that four modules in current sharing mode deliver 160 w with only 40c rise and 88% efficiency (12v in , 1v out , 400lfm). the ltm4636 is offered in a 16mm 16mm 7.07mm bga package. l, lt , lt c , lt m , polyphase, burst mode, module, linear technology, ltpowercad and the linear logo are registered trademarks of linear technology corporation. all other trademarks are the property of their respective owners. protected by u.s. patents, including 5481178, 5847554, 6580258, 6304066, 6476589, 6774611, 6677210, 8163643. 1v, 40a dc/dc module regulator fea t ures a pplica t ions n stacked inductor acts as heat sink n wide input voltage range: 4.7v to 15v n 0.6v to 3.3v output voltage range n 1.3% total dc output voltage error over line, load and t emperature (C40c to 125c) n differential remote sense amplifier for precision regulation n current mode control/fast transient response n frequency synchronization n parallel current sharing (up to 240a) n internal or external compensation n 88% efficiency (12v in , 1v out ) at 40a n overcurrent foldback protection n 16mm 16mm 7.07mm bga package n telecom servers and networking equipment n industrial equipment and medical systems 12v in , 1v out efficiency vs output current runc runp hizreg freq temp + temp ? sgnd v in 1v 34.8k 22f 0.1f 22f 16v 5 4.70v to 15v 100f 25v intv cc pv cc v in 5.5v, tie v in , intv cc and pv cc together, tie runp to gnd. v in > 5.5v, then operate as shown optional temp monitor intv cc intv cc pv cc ltm4636 pv cc pgnd v outs1 + v out v outs1 ? v fb + 470f 6.3v 3 + 7.5k 100f 6.3v 4 v out 1v, 40a 4636 ta01a pins not used in this circuit: clkout, gmon, pgood, phmode, pwm, sw, test1, test2, test3, test4, tmon compa compb snsp1 snsp2 mode/pllin track/ss 15k output current (a) 0 efficiency (%) 90 95 100 15 25 4636 ta01b 85 80 5 10 20 30 40 35 75 70 ltm4636 4636f
2 for more information www.linear.com/ltm4636 a bsolu t e maxi m u m r a t ings v in , sw, hzbreg , runp ........................... C 0.3 v to 16 v v out .......................................................... C0. 3 v to 3.5 v pgood , runc, tmon , pv cc , mode / pllin , phmode , freq , track / ss , test 1, test 2, v outs 1 C , v outs 1 + , snsp 1, snsp2, test 3, test 4 ..... C 0.3 v to intv cc (5 v) v fb , compa , compb ( note 7) .................. C 0.3 v to 2.7 v pv cc additional output current ................ 0 ma to 50 ma (note 1) p in c on f igura t ion 1 m l k j h g f e d c b a top view bga package 144-lead (16mm 16mm 7.07mm) v out gnd gnd gnd gnd sw v in 2 3 4 5 6 7 8 9 10 11 12 pgood runc snsp2 snsp1 compb test2 test4 (float pin) intv cc temp ? temp + clkout sgnd v fb v outs1 + hizreg track/ss compa v outs1 ? freq pwm test3 mode/pllin test1 tmon nc gmon phasmd runp pv cc t jmax = 125c, ja = 7.5c/w, jcbottom = 3c/w, jctop = 15c/w, jba = 12c/w ja = derived from 95mm 76mm pcb with 6 layers, weight = 3.95g values determined per jesd51-12 note: ja = ( jcbottom + jba )|| jctop ; jba is board to ambient temp + , temp C .......................................... C0. 3 v to 0.8 v intv cc peak output current ( note 6) .................... 20 ma i nternal operating temperature range ( note 2) .................................................. C 40 c to 125 c storage temperature range .................. C 55 c to 125 c reflow ( peak body ) temperature .......................... 25 0 c o r d er i n f or m a t ion http://www .linear.com/product/ltm4636#orderinfo note : pwm , clkout , and gmon are outputs only . part number pad or ball finish part marking* package type msl ra ting temperature range (see note 2) device finish code ltm4636ey#pbf sac305 (rohs) ltm4636 bga C40c to 125c ltm4636iy#pbf C40c to 125c ? device temperature grade is indicated by a label on the shipping container. ? pad or ball finish code is per ipc/jedec j-std-609. ? terminal finish part marking: www.linear.com/leadfree ? this product is not recommended for second side reflow. for more information, go to www.linear.com/bga-assy ? recommended bga pcb assembly and manufacturing procedures: www.linear.com/bga-assy ? bga package and tray drawings: www.linear.com/packaging ? this product is moisture sensitive. for more information, go to: www.linear.com/bga-assy ltm4636 4636f
3 for more information www.linear.com/ltm4636 e lec t rical c harac t eris t ics the l denotes the specifications which apply over the specified internal operating temperature range (note 2), otherwise specifications are at t a = 25c. v in = 12v, per the typical application in figure 20. symbol parameter conditions min typ max units v in input dc voltage v in 5.5v, tie v in , intv cc and pv cc together, tie runp to gnd l 4.7 15 v v out v out range l 0.6 3.3 v v out(dc) dc output voltage, total variation with line and load c in = 22f 5 c out = 100f 4 ceramic, 470f poscap 3 r fb = 40.2k, mode_pllin = gnd v in = 4.75v to 15v, i out = 0a to 40a (note 4) l 1.4805 1.5 1.5195 v input specifications v runc runc pin on threshold v runc rising 1.1 1.22 1.35 v v runchys runc pin on hysteresis 150 mv v runp runp pin on threshold runp pin rising l 0.7 0.8 0.9 v runp hys runp pin hysteresis 60 mv hizreg hizreg input threshold v in = 12v, runc = 5v, runp = v in , v out = 1.5v 2.3 v hizreg hys hizreg hysteresis v in = 12v, runc = 5v, runp = v in , v out = 1.5v 0.8 v i q(vin) input supply bias current v in = 12v, v out = 1.5v, burst mode operation, i out = 0.1a v in = 12v, v out = 1.5v, pulse-skipping mode, i out = 0.1a v in = 12v, v out = 1.5v, switching continuous, i out = 0.1a shutdown, run = 0, v in = 12v 16 23 105 30 ma ma ma a i s(vin) input supply current v in = 5v, v out = 1.5v, i out = 40a v in = 12v, v out = 1.5v, i out = 40a 14.7 5.66 a a output specifications i out(dc) output continuous current range v in = 12v, v out = 1.5v (note 4) 0 40 a ?v out (line) v out line regulation accuracy v out = 1.5v, v in from 4.75v to 15v i out = 0a l 0.02 0.06 %/v ?v out (load) v out load regulation accuracy v out = 1.5v, i out = 0a to 40a, v in = 12v (note 4) l 0.2 0.35 % v out(ac) output ripple voltage i out = 0a, c out = 100f 3 ceramic, 470f 3 poscap, v in = 12v, v out = 1.5v 15 mv p-p ?v out(start) turn-on overshoot c out = 100f 4 ceramic, 470f 3 poscap, v out = 1.5v, i out = 0a, v in = 12v, track/ss = 0.1f 5 mv t start turn-on time c out = 100f 3 ceramic, 470f 3 poscap, no load, track/ss = 0.001f, v in = 12v 50 ms ?v outls peak deviation for dynamic load load: 0% to 50% to 0% of full load c out = 100f 4 ceramic, 470f 3 poscap, v in = 12v, v out = 1.5v, cff = 22pf 45 mv t settle settling time for dynamic load step load: 0% to 50% to 0% of full load, v in = 5v, c out = 100f 4 ceramic, 470f 3 poscap, v in = 12v, v out = 1.5v, cff = 22pf 25 s i outpk output current limit v in = 12v, v out = 1.5v v in = 5v, v out = 1.5v 54 54 a a control section v fb voltage at v fb pin i out = 0a, v out = 1.5v l 0.594 0.600 0.606 v i fb current at v fb pin (note 6) C30 C100 na v ovl feedback overvoltage lockout measure at v outs1 l 5 7.5 10 % i track/ss track pin soft-start pull-up current track/ss = 0v, default 750s turn on with track/ss tied to intv cc 1.1 1.35 1.6 a t on(min) minimum on-time (note 3) 100 ns r fbhi resistor between v outs1 and v fb pins 4.99 k ltm4636 4636f
4 for more information www.linear.com/ltm4636 symbol parameter conditions min typ max units remote sense amplifier a v(vfb) v fb differential gain (note 6) 1 v/v gbp v fb path gain bandwidth product (note 5) 4 mhz general control or monitor pins i tmon temperature monitor current, t j = 25c into 25k temperature monitor current, t j = 150c into 25k 38 40.3 58 44 a a i tmon(slope) temperature monitor current slope, r tmon = 25k 0.144 a/c v pgood pgood trip level v fb with respect to set output v fb ramping negative v fb ramping positive C7.5 7.5 % % v pgl pgood voltage low i pgood = 2ma 0.2 0.4 v t pgood v pgood high-to-low delay 65 s i pgood(off) pgood leakage current v pgood = 5v C2 2 a v pg1(hyst) pgood trip level hysteresis 2.5 % intv cc linear regulator v intvcc internal v cc voltage source 6v < v in < 15v 5.3 5.5 5.7 v v intvcc load reg intv cc load regulation i cc = 0ma to 10ma 0.5 % uvlo hys controller uvlo hysteresis (note 6) 0.5 v pv cc(uvlo) drivers and power mosfets uvlo pv cc rising 3.5 3.8 4.1 v pv cc(hys) pv cc uvlo hysteresis 0.45 v pv cc power stage bias 12v input, pv cc load = 50mm 5.0 v oscillator and phase-locked loop f osc oscillator frequency v phsmd = 0v r freq = 30.1k r freq = 47.5k r freq = 54.9k r freq = 75.0k maximum frequency minimum frequency l l 210 540 625 945 1.2 250 600 750 1.05 290 660 825 1.155 0.2 khz khz khz mhz mhz mhz i freq freq pin output current v freq = 0.8v 19 20 21 a r mode/pllin mode_pllin input resistance 250 k v mode/pllin pllin input threshold v mode/pllin rising v mode/pllin falling 2 1.2 v v v clkout low output voltage high output voltage verified levels measurements on clkout 0.2 5.2 v v pwm -clkout pwm to clockout phase delay v phsmd = 0v v phsmd = 1/4 intv cc v phsmd = float v phsmd = 3/4 intv cc v phsmd = intv cc 90 90 120 60 180 deg deg deg deg deg pwm /pwmen outputs pwm pwm output high voltage i load = 500a 5.0 v pwm output low voltage i load = C500a 0.5 v e lec t rical c harac t eris t ics the l denotes the specifications which apply over the specified internal operating temperature range (note 2), otherwise specifications are at t a = 25c. v in = 12v, per the typical application in figure 20. ltm4636 4636f
5 for more information www.linear.com/ltm4636 e lec t rical c harac t eris t ics the l denotes the specifications which apply over the specified internal operating temperature range (note 2), otherwise specifications are at t a = 25c. v in = 12v, per the typical application in figure 20. note 1: stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. exposure to any absolute maximum rating condition for extended periods may affect device reliability and lifetime. note 2: the ltm4636 is tested under pulsed load conditions such that t j t a . the ltm4636e is guaranteed to meet performance specifications over the 0c to 125c internal operating temperature range. specifications over the full C40c to 125c internal operating temperature range are assured by design, characterization and correlation with statistical process controls. the ltm4636i is guaranteed to meet specifications over the full C40c to 125c internal operating temperature range. note that the maximum ambient temperature consistent with these specifications is determined by specific operating conditions in conjunction with board layout, the rated package thermal resistance and other environmental factors. note 3: the minimum on-time condition is specified for a peak-to-peak inductor ripple current of ~40% of i max load. (see the applications information section) note 4: see output current derating curves for different v in , v out and t a . note 5: guaranteed by design. note 6: 100% tested at wafer level. symbol parameter conditions min typ max units temperature diode diode v f diode forward voltage i = 100a, temp + to temp C 0.598 v tc temperature coefficient l C2.0 mv/c typical p er f or m ance c harac t eris t ics burst mode efficiency vs load current 1v transient response 1.2v transient response efficiency vs load current with 5v in efficiency vs load current with 8v in efficiency vs load current with 12v in output current (a) 0 efficiency (%) 100 90 80 95 85 75 70 25 15 35 4636 g01 40 20 105 30 3.3v out , 500khz 2.5v out , 500khz 1.8v out , 450khz 1.5v out , 425khz 1.2v out , 300khz 1v out , 300khz output current (a) 0 efficiency (%) 100 90 80 95 85 75 70 25 15 35 4636 g02 40 20 105 30 3.3v out , 700khz 2.5v out , 600khz 1.8v out , 500khz 1.5v out , 450khz 1.2v out , 400khz 1v out , 350khz output current (a) 0 efficiency (%) 100 90 80 95 85 75 70 25 15 35 4636 g03 40 20 105 30 3.3v out , 750khz 2.5v out , 650khz 1.8v out , 600khz 1.5v out , 550khz 1.2v out , 400khz 1v out , 350khz output current (a) 0 efficiency (%) 100 80 60 90 70 50 40 32 4 4636 g04 5 1 burst mode operation v in 12v v out 1.5v 12v to 1v transient response c out = 4 100f ceramic, 3 470f 2.5v poscap 5m c ff = 22pf, sw freq = 400khz 10a/div 18a/s step 50mv/div 50s/div 4636 g05 12v to 1.2v transient response c out = 4 100f ceramic, 3 470f 2.5v poscap 5m c ff = 22pf, sw freq = 400khz c comp = 100pf 10a/div 18a/s step 50mv/div 50s/div 4636 g06 ltm4636 4636f
6 for more information www.linear.com/ltm4636 typical p er f or m ance c harac t eris t ics 2.5v transient response 1.5v transient response 3.3v transient response 40a load short-circuit 1.8v transient response start-up with soft-start no-load start-up with 0.5v output pre-bias start-up with soft-start full load no-load short-circuit run pin capacitor = 0.1f track/ss capacitor = 0.1f c out = 4 100f ceramic and 3 470f poscap 20ms/div v in 5v/div v out 0.5v/div 4636 g11 run pin capacitor = 0.1f track/ss capacitor = 0.1f c out = 4 100f ceramic and 3 470f poscap 20ms/div v in 5v/div v out 0.5v/div 4636 g12 100s/div l in 200ma/div v out 0.5v/div 4636 g13 run pin capacitor = 0.1f track/ss capacitor = 0.1f c out = 4 100f ceramic and 3 470f 20ms/div v in 5v/div v out 0.5v/div 4636 g14 100s/div l in 200ma/div v out 0.5v/div 4636 g15 12v to 1.5v transient response c out = 4 100f ceramic, 3 470f 2.5v poscap 5m c ff = 22pf, sw freq = 425khz c comp = 100pf 10a/div 18a/s step 50mv/div 50s/div 4636 g07 12v to 1.8v transient response c out = 6 100f ceramic, 2 470f 4v poscap 5m c ff = 22pf, sw freq = 500khz c comp = 100pf 10a/div 18a/s step 50mv/div 100s/div 4636 g08 12v to 2.5v transient response c out = 6 100f ceramic, 2 470f 4v poscap 5m c ff = 22pf, sw freq = 650khz c comp = 100pf 10a/div 18a/s step 100mv/div 100s/div 4636 g09 12v to 3.3v transient response c out = 6 100f ceramic, 2 470f 4v poscap 5m c ff = 22pf, sw freq = 750khz c comp = 100pf 10a/div 18a/s step 100mv/div 100s/div 4636 g10 ltm4636 4636f
7 for more information www.linear.com/ltm4636 p in func t ions v out ( a 1-a 12, b 1-b 12, c 1-c 12, d 1-d 2, d 11-d 12): power output pins. apply output load between these pins and gnd pins. recommend placing output decoupling capacitance between these pins and gnd pins. review table 4. mode_ pllin ( h 3): forced continuous mode, burst mode operation, or pulse-skipping mode selection pin and external synchronization input to phase detector pin. connect this pin to intv cc to enable pulse-skipping mode of operation. connect to ground to enable forced continuous mode of operation. floating this pin will enable burst mode operation. a clock on this pin will enable synchronization with forced continuous operation. see the applications information section. v outs1 C (d3): vout sense ground for the remote sense amplifier. this pin connects to the ground remote sense point. connect to ground when not used. see the applica - tions information section. v outs1 + (d4): this pin should connect to v out and is connected to v fb through a 4.99 k resistor. this pin is used to connect to a remote sense point of the load for accurate voltage sensing. either connect to remote sense point or directly to v out . see the applications information section for details. compb ( d 5): internal compensation network provided that coincides with proper stability utilizing the values in table 5. just connect this pin to compa for internal compensa - tion. in parallel operation with other ltm4636 devices, connect compa and compb pins together for internal compensation, then connect all compa pins together. gnd ( d6-d10, e6-e10, e12, f7, f8, f10-f12, g1-g2, g6 g10, h1, h10-h12, j1-j3, j8-j12, k1-k3, k9-k10, k12, l1-l3, l9-l10, l12, m1-m3, m9-m12): ground pins for both input and output returns. pgood ( e 1): output voltage power good indicator. open - drain logic output is pulled to ground when the output voltage exceeds a 7.5% regulation window. runc (e2): run control pin. a voltage above 1.35 v will turn on the control section of the module. a 10 k resistor to ground is internal to the module for setting the run pin threshold with a resistor to 5 v, and allowing a pull- up resistor to pv cc for enabling the device. see figure 1 block diagram. track/ ss ( e 3): output voltage tracking pin and soft- start inputs. the pin has a 1.25 a pull-up current source. a capacitor from this pin to ground will set a soft-start ramp rate. in tracking, the regulator output can be tracked to a different voltage. the different voltage is applied to a voltage divider then to the slave outputs track pin. this voltage divider is equal to the slave outputs feedback divider for coincidental tracking. default soft-start of 750 s with track/ss pin connected to intv cc pin. see the applica- tions information section. in polyphase ? applications tie the track/ss pins together. v fb (e4): the negative input of the error amplifier. inter- nally, this pin is connected to v outs1 with a 4.99 k precision resistor. different output voltages can be programmed with an additional resistor between v fb and v outs1 C . in polyphase operation, tying the v fb pins together allows for parallel operation. see the applications information section. compa ( e 5): current control threshold and error amplifier compensation point. the current comparator threshold increases with this control voltage. tie all compa pins together for parallel operation. this pin allows external compensation. see the applications information section. snsp2 (f1): current sense signal path. connect this pin to snsp1 (f2). snsp1 (f2): current sense signal path. connect this pin to snsp 2 (f 1). both pins are used to calibrate current sense matching and current limit at final test. hizreg (f3): when this pin is pulled low the power stage is disabled into high impedance. tie this pin to v in or in tv cc for normal operation. package row and column labeling m ay vary among module products. review each package layout carefully. ltm4636 4636f
8 for more information www.linear.com/ltm4636 p in func t ions sgnd (f 4, g 4): signal ground pin. return ground path for all analog and low power circuitry. tie a single connection to the output capacitor gnd in the application. see layout guidelines in figure 18. intv cc (f6): internal 5.5 v ldo for driving the control circuitry in the ltm4636. intv cc is controlled and enabled when runc is activated high. tie to v in , when 4.7v v in 5.5v, minimum v in = 4.2v. freq (g5): a resistor can be applied from this pin to ground to set the operating frequency. this pin sources 20a. see the applications information section. phasmd (g7): this pin can be voltage programmed to change the phase relationship of the clkout pin with reference to the internal clock or an input synchronized clock. the intv cc (5.5 v) output can be voltage divided down to the phasmd pin to set the particular phase. the electrical characteristics show the different settings to select a particular phase. see the applications informa - tion section. runp ( g8): this pin enables the pv cc supply. this pin can be connected to v in , or tie to ground when connecting pv cc to v in 5.5 v. runp needs to sequence up before runc. a 15 k resistor from pv cc to runc with a 0.1f capacitor will provide enough delay. in parallel operation with multiple ltm4636s, the resistor can be reduced in value by n times and the 0.1 f can be increased n times. see applications information section. runp can be used to set the minimum uvlo with a voltage divider. see figure 1. nc (g9): no connection. pv cc (f9): 5 v power output and power for internal power mosfet drivers. the regulator can power 50ma of external sourcing for additional use. place a 22 f ceramic filter capacitor on this pin to ground. when v in < 5.5 v, tie v in and pv cc together along with intv cc . then tie runp to gnd. if v in > 5.5 v then operate pv cc regulator as normal. see the typical application examples. temp + (g12): temperature monitor. an internal diode connected npn transistor. see the applications informa- tion section. temp C (g11): low side of the internal temperature monitor. clkout (g3): clock out signal that can be phase selected to the main internal clock or synchronized clock using the phasmd pin. clkout can be used for multiphase applications. see the applications information section. test1 (h 4), test 2 (f 5), test 3 (h 2), test 4 (e 11), gmon (h9): these are test pins used in the final production test of the part. leave floating. v in ( h5-h6, j4-j7, k4-k8, l4-l8, m4-m8): power input pins. apply input voltage between these pins and gnd pins. recommend placing input decoupling capacitance directly between v in and gnd pins. pwm (h7): pwm output that drives the power stage. primarily used for test, but can be monitored in debug or testing. tmon ( h 8): temperature monitor pin. internal temperature monitor, varies from 1 v at 25 c to 1.44 v at 150c , disables power stage at 150 c. if this feature is not desired, then tie the tmon pin to gnd. sw ( l11, k11): these are pin connections to the internal switch node for test evaluation and monitoring. an r-c snubber can be placed from the switch pins to gnd to eliminate any high frequency ringing. see the applications information section. ltm4636 4636f
9 for more information www.linear.com/ltm4636 b lock diagra m figure 1. simplified ltm4636 block diagram pgood + tdrv pwm input 150c disable disable temp monitor current imon 40a at 25c 60a at 150c pwm logic contol, power mosfet drivers, power mosfet m1 0.18h snsp2 sns ? bdrv m2 24.9k 1% 4.99k 0.5% 0.1f 10pf 0.1f soft-start 10k 1% uvlo example > 1.35v = on 15k = (pv cc ? 1.35v)(10k)/1.35v disables at ~ 3.75v pv cc 5v 15k 10k intv cc pv cc snsp1 snsp1 and snsp2 connected at pcb sns ? 470pf q1 1f 22f v in pv cc > 0.85v = on internal 5v regulator 2.2 2.2, 0805 sgnd snsp2 connect to snsp1 temp ? gmon tmon pwm v outs1 ? temp ? temp + gnd v out v out 1.5v at 40a sw v in v in 4.70v to 15v v in 5.5v, tie to v in , intv cc and pv cc together,tie runp to gnd. v in > 5.5v operate as shown v in uvlo example c in runp r1 pv cc optimized dead time control dcr sense network 5v v outs1 + 4636 f01 + ? v fb diff amp current sense pwm power control freq track/ss v fb r6 3.32k mode_pllin intvcc 5.5v snsp1 phmode hizreg intv cc clkout sgnd compb compa runc test3 test2 test1 test4 r freq 40k + ? + c out 4.7f internal comp 1f 2200pf 15k r1 = (v in ? 0.85v) (15k) 0.85v ltm4636 4636f
10 for more information www.linear.com/ltm4636 decoupling r equire m en t s symbol parameter conditions min typ max units c in external input capacitor requirement (v in = 4.70 v to 16 v, v out = 1.5 v) i out = 40a, 6 22f ceramic x7r capacitors (see table 4) 100 f c out external output capacitor requirement (v in = 4.70 v to 16 v, v out = 1.5 v) i out = 40a (see table 4) 1000 f t a = 25c. use figure 1 configuration . power module description the ltm4636 is a high efficiency regulator that can provide a 40a output with few external input and output capacitors. this module provides precisely regulated output voltages programmable via external resistors from 0.6 v dc to 3.3v dc over a 4.70 v to 15 v input range. the typical applica - tion schematic is shown in figure 20. the ltm4636 has an integrated constant-frequency cur- rent mode regulator, power mosfets , 0.18 h inductor, protection circuitry , 5 v regulator and other supporting discrete components. the switching frequency range is from 250khz to 770 khz, and the typical operating frequency is 400 khz. for switching noise-sensitive applications, it can be externally synchronized from 250 khz to 800khz, subject to minimum on-time limitations and limiting the inductor ripple current to less than 40% of maximum output current. a single resistor is used to program the frequency. see the applications information section. with current mode control and internal feedback loop compensation, the ltm4636 module has sufficient stabil- ity margins and good transient performance with a wide range of output capacitors, even with all ceramic output capacitors. an option has been provided for external loop compensation. ltpowercad ? can be used to optimize the external compensation option. see the applications information section. current mode control provides cycle-by-cycle fast current limit in an overcurrent condition. an internal overvoltage o pera t ion monitor feedback pin referred will attempt to protect the output voltage in the event of an overvoltage >10%. the top mosfet is turned off and the bottom mosfet is turned on until the output is cleared. pulling the runc pin below 1.1 v forces the regulator con - troller into a shutdown state. the track/ss pin is used for programming the output voltage ramp and voltage tracking during start-up. see the applications information section. the ltm4636 is internally compensated to be stable over all operating conditions. table 5 provides a guideline for input and output capacitances for several operating condi - tions. ltpowercad is available for transient and stability analysis. this tool can be used to optimize the regulators loop response. a remote sense amplifier is provided for accurately sensing output voltages at the load point. multiphase operation can be easily employed with the internal clock source or a synchronization clock applied to the mode/pllin input using an external clock source, and connecting the clkout pins. see the applications information section. review figure 4. high efficiency at light loads can be accomplished with selectable burst mode operation using the mode_pllin pin. these light load features will accommodate battery operation. efficiency graphs are provided for light load op- eration in the typical performance characteristics section. a temp + and temp C pins are provided to allow the internal device temperature to be monitored using an onboard diode connected npn transistor. ltm4636 4636f
11 for more information www.linear.com/ltm4636 a pplica t ions i n f or m a t ion the typical ltm4636 application circuit is shown in figure 20. external component selection is primarily determined by the maximum load current and output voltage. refer to table 5 for specific external capacitor requirements for particular applications. v in to v out step-down ratios there are restrictions in the v in to v out step- down ratio that can be achieved for a given input voltage. the maximum duty cycle is 94% typical at 500 khz operation. the v in to v out minimum dropout is a function of load current and operation at very low input voltage and high duty cycle applications. at very low duty cycles the minimum 100ns on-time must be maintained. see the frequency adjust - ment section and temperature derating curves. output v oltage programming the pwm controller has an internal 0.6v 1% reference voltage. as shown in the block diagram, a 4.99 k internal feedback resistor connects the v outs1 + and v fb pins to- gether. when the remote sensing is used, then v outs1 + and v outs1 C are connected to the remote v out and gnd points. if no remote sense the v outs1 + connects to v out . the output voltage will default to 0.6 v with no feedback resistor. adding a resistor r fb from v fb to ground pro- grams the output voltage: v out = 0.6v ? 4.99k + r fb r fb table 1. v fb resistor table vs various output voltages v out (v) 0.6 1.0 1.2 1.5 1.8 2.5 3.3 r fb (k) open 7. 5 4.99 3.32 2.49 1.58 1.1 for parallel operation of n ltm4636s , the following equation can be used to solve for r fb : r fb = 4.99k / n v out 0.6v C 1 or use v outs1 on one channel and connect all feedback pins together utilizing a single feedback resistor. tie the v fb pins together for each parallel output. the comp pins must be tied together also. see typical application section examples. input capacitors the ltm4636 module should be connected to a low ac- impedance dc source. additional input capacitors are needed for the rms input ripple current rating. the i cin ( rms ) equation which follows can be used to calculate the input capacitor requirement. typically 22 f x7r ceramics are a good choice with rms ripple current ratings of ~4 a each. a 47 f to 100 f surface mount aluminum electrolytic bulk capacitor can be used for more input bulk capacitance. this bulk input capacitor is only needed if the input source impedance is compromised by long inductive leads, traces or not enough source capacitance. if low impedance power planes are used, then this bulk capacitor is not needed. for a buck converter, the switching duty cycle can be estimated as: d = v out v in without considering the inductor ripple current, for each output the rms current of the input capacitor can be estimated as: i cin(rms) = i out(max) % ? d ? (1Cd) where % is the estimated efficiency of the power mod- ule. the bulk capacitor can be a switcher-rated aluminum electrolytic capacitor or a polymer capacitor. ltm4636 4636f
12 for more information www.linear.com/ltm4636 a pplica t ions i n f or m a t ion output capacitors the ltm4636 is designed for low output voltage ripple noise. the bulk output capacitors defined as c out are chosen with low enough effective series resistance (esr) to meet the output voltage ripple and transient require - ments. c out can be a low esr tantalum capacitor, low esr polymer capacitor or ceramic capacitors. the typi- cal output capacitance range is from 400 f to 1000f. additional output filtering may be required by the system designer if further reduction of output ripple or dynamic transient spikes is required. table 5 shows a matrix of dif - ferent output voltages and output capacitors to minimize the voltage droop and overshoot during a 15 a/s tran- sient. the table optimizes total equivalent esr and total bulk capacitance to optimize the transient performance. stability criteria are considered in the table 5 matrix, and ltpowercad is available for stability analysis. multiphase operation will reduce effective output ripple as a function of the number of phases. application note 77 discusses this noise reduction versus output ripple current cancel - lation, but the output capacitance should be considered carefully as a function of stability and transient response. ltpowercad can be used to calculate the output ripple reduction as the number of implemented phases increases by n times. external loop compensation can be used for transient response optimization. burst mode operation the ltm4636 is capable of burst mode operation in which the power mosfets operate intermittently based on load demand, thus saving quiescent current. for applications where maximizing the efficiency at very light loads is a high priority, burst mode operation should be applied. to enable burst mode operation, simply float the mode_ pllin pin. during burst mode operation, the peak current of the inductor is set to approximately 30% of the maximum peak current value in normal operation even though the voltage at the compa pin indicates a lower value. the voltage at the compa pin drops when the inductors aver - age current is greater than the load requirement. as the comp a voltage drops below 0.5 v, the burst comparator trips, causing the internal sleep line to go high and turn off both power mosfets. in sleep mode, the internal circuitry is partially turned off, reducing the quiescent current. the load current is now being supplied from the output capacitors. when the output voltage drops, causing compa to rise, the internal sleep line goes low, and the ltm4636 resumes normal operation. the next oscillator cycle will turn on the top power mosfet and the switching cycle repeats. pulse-skipping mode operation in applications where low output ripple and high efficiency at intermediate currents are desired, pulse - skipping mode should be used. pulse-skipping operation allows the ltm4636 to skip cycles at low output loads, thus increasing efficiency by reducing switching loss. tying the mode_pllin pin to intv cc enables pulse-skipping operation. with pulse-skipping mode at light load, the internal current comparator may remain tripped for several cycles, thus skipping operation cycles. this mode has lower ripple than burst mode operation and maintains a higher frequency operation than burst mode operation. forced continuous operation in applications where fixed frequency operation is more critical than low current efficiency, and where the lowest output ripple is desired, forced continuous operation should be used. forced continuous operation can be enabled by tying the mode_pllin pin to ground. in this mode, inductor current is allowed to reverse during low output loads, the compa voltage is in control of the current comparator threshold throughout, and the top mosfet always turns on with each oscillator pulse. during start- up, forced continuous mode is disabled and inductor current is prevented from reversing until the ltm4636s output voltage is in regulation. ltm4636 4636f
13 for more information www.linear.com/ltm4636 multiphase operation for outputs that demand more than 40 a of load current, multiple ltm4636 devices can be paralleled to provide more output current without increasing input and output ripple voltage. the mode_pllin pin allows the ltm4636 to be synchronized to an external clock and the internal phase- locked loop allows the ltm4636 to lock onto input clock phase as well. the freq resistor is selected for normal frequency, then the incoming clock can synchronize the device over the specified range. a multiphase power supply significantly reduces the amount of ripple current in both the input and output ca - pacitors. the rms input ripple current is reduced by, and the effective ripple frequency is multiplied by, the number of phases used ( assuming that the input voltage is greater than the number of phases used times the output voltage). the output ripple amplitude is also reduced by the number of phases used. see application note 77. the ltm4636 device is an inherently current mode con- trolled device , so parallel modules will have good current sharing. this will balance the thermals in the design. tie the compa to compb and then tie the compa pins together, tie v fb pins of each ltm4636 together to share the cur- rent evenly . figure 21 shows a schematic of the parallel design. for external compensation and parallel operation only tie comp a pins together with external compensation . input rms ripple current cancellation application note 77 provides a detailed explanation of multiphase operation. the input rms ripple current can- cellation mathematical derivations are presented, and a graph is displayed representing the rms ripple current reduction as a function of the number of interleaved phases (see figure 2). pll, frequency adjustment and synchronization the ltm4636 switching frequency is set by a resistor ( r freq ) from the freq pin to signal ground. a 20 a current ( i freq ) flowing out of the freq pin through r freq develops a voltage on the freq pin. r freq can be calculated as: r freq = freqv 20a a pplica t ions i n f or m a t ion figure 2. normalized input rms ripple current vs duty cycle for one to six module regulators (phases) 0.75 0.8 4636 f02 0.70.650.60.550.50.450.40.350.30.250.20.150.1 0.85 0.9 duty cycle (v out /v in ) 0 dc load current rms input ripple current 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 1 phase 2 phase 3 phase 4 phase 6 phase ltm4636 4636f
14 for more information www.linear.com/ltm4636 the relationship of freqv voltage to switching frequency is shown in figure 3. for low output voltages from 0.6v to 1.2v, 350 khz operation is an optimal frequency for the best power conversion efficiency while maintaining the inductor current to about 45% of maximum load current. for output voltages from 1.5 v to 1.8v, 500 khz is optimal. for output voltages from 2.5 v to 3.3v, 700 khz is optimal. see efficiency graphs for optimal frequency set point. limit the 2.5v and 3.3v outputs to 35a. the ltm4636 can be synchronized from 200khz to 1200khz with an input clock that has a high level above 2v and a low level below 1.2 v. see the typical applica - tions section for synchronization examples. the ltm4636 minimum on -time is limited to approximately 100 ns. the on-time can be calculated as: t on(min) = 1 freq ? v out v in ? ? ? ? ? ? a pplica t ions i n f or m a t ion the ltm4636's clkout pin phase difference from v out can be programmed by applying a voltage to the phmode pin. this voltage can be programmed using the 5.5 v intv cc pin. most of the phase selections can be programmed by either grounding, floating, or tying this pin to intv cc . the 60 degree phase shift will require 3/4 intv cc and can be programmed with a voltage divider from the intv cc pin. see figure 4 for phase programming and the 2 to 6 phase connections. see figure 27 for example design. output voltage tracking output voltage tracking can be programmed externally using the track /ss pin. the output can be tracked up and down with another regulator. the master regulators output is divided down with an external resistor divider that is the same as the slave regulators feedback divider to implement coincident tracking. the ltm4636 uses an figure 3. freq voltage to switching frequency v freq (v) 0.4 frequency (khz) 900 1100 1300 1.0 1.4 4636 f03 700 500 0.6 0.8 1.2 1.6 1.8 300 100 ltm4636 4636f
15 for more information www.linear.com/ltm4636 a pplica t ions i n f or m a t ion accurate 4.99 k resistor internally for the top feedback resistor. figure 5 shows an example of coincident tracking. v out(slave) = 1 + 4.99k r ta ? ? ? ? ? ? ? v track v track is the track ramp applied to the slaves track pin. v track has a control range of 0 v to 0.6 v, or the internal reference voltage. when the masters output is divided down with the same resistor values used to set the slaves output, then the slave will coincident track with the master until it reaches its final value. the master will continue to its final value from the slaves regulation point ( see figure 6). voltage tracking is disabled when v track is more than 0.6 v. r ta in figure 5 will be equal to r fb for coincident tracking. the track /ss pin of the master can be controlled by an external ramp or the soft- start function of that regulator can be used to develop that master ramp. the ltm4636 can be used as a master by setting the ramp rate on its track pin using a soft-start capacitor. a 1.25 a current source is used to charge the soft-start capacitor. the following equation can be used: t soft-start = 0.6v ? c ss 1.25a ? ? ? ? ? ? figure 4. phase selection examples ltm4636 180 phase mode_pllin phmode clkout v out 3/4 intv cc ltm4636 240 phase mode_pllin phmode clkout v out 3/4 intv cc ltm4636 300 phase mode_pllin phmode 4636 f04 clkout v out 3/4 intv cc ltm4636 0 phase mode_pllin phmode r2 10k r1 30.1k clkout v out ltm4636 0 phase mode_pllin phmode clkout v out ltm4636 90 phase mode_pllin phmode clkout v out ltm4636 180 phase mode_pllin phmode clkout v out ltm4636 270 phase mode_pllin phmode clkout v out 3/4 intv cc intv cc ltm4636 60 phase six phase four phase ltm4636 0 phase mode_pllin phmode clkout v out ltm4636 120 phase mode_pllin phmode clkout v out ltm4636 240 phase mode_pllin phmode clkout v out three phase ltm4636 0 phase mode_pllin phmode clkout v out ltm4636 180 phase mode_pllin phmode clkout v out float intv cc two phase mode_pllin phmode clkout v out 3/4 intv cc ltm4636 120 phase mode_pllin phmode clkout v out 3/4 intv cc v out phase 0 0 0 0 0 clkout phase 90 90 120 60 180 phmode (v) 0 1/4 intv cc float 3/4 intv cc intv cc phase selection ltm4636 4636f
16 for more information www.linear.com/ltm4636 a pplica t ions i n f or m a t ion figure 5. dual outputs (1.5v and 1.2v) with tracking figure 6. output voltage coincident tracking characteristics 4636 f06 time slave output master output output voltage + compa compb track/ss runc runp hizreg freq tmon sw v out temp + temp ? snsp1 snsp2 sgnd v in 15k 5v pv cc1 1.5v at 40a 2.2, 0805 2200pf 40.2k 40.2k c ss 0.1f 22f voltage out temp monitor 0.1f 22f 16v 5 4.7v to 15v 100f 25v intv cc1 optional temp monitor for telemetry readback ics intv cc intv cc1 5v pv cc1 ltm4636 pv cc pgnd v outs1 + v outs1 ? v fb + 470f 6.3v 470f 6.3v + + 470f 6.3v r fb 3.32k 100f 4 6.3v 4636 f05 + compa compb track/ss runc runp hizreg freq tmon sw v out temp + temp ? snsp1 snsp2 sgnd v in 15k 1.5v 5v pv cc2 1.2v at 40a r7b 4.99k r7a 4.99k 22f voltage out temp monitor 0.1f 22f 16v 5 intv cc2 optional temp monitor for telemetry readback ics intv cc intv cc2 5v pv cc2 ltm4636 pv cc pgnd v outs1 + v outs1 ? v fb 470f 6.3v 470f 6.3v + + 470f 6.3v r fb1 4.99k 100f 4 6.3v pins not used in this circuit: clkout, gmon, mode/pllin, pgood, phmode, pwm, test1, test2, test3, test4 2.2, 0805 2200pf ltm4636 4636f
17 for more information www.linear.com/ltm4636 a pplica t ions i n f or m a t ion ratiometric tracking can be achieved by a few simple calculations and the slew rate value applied to the master s track/ss pin. as mentioned above, the track/ss pin has a control range from 0 v to 0.6 v. the masters track/ss pin slew rate is directly equal to the masters output slew rate in volts/time. the equation: mr sr ? 4.99k = r tb where mr is the masters output slew rate and sr is the slaves output slew rate in volts/time. when coincident tracking is desired, then mr and sr are equal, thus r tb is equal to 4.99k. r ta is derived from equation: r ta = 0.6v v fb 4.99k + v fb r fb1 C v track r tb where v fb is the feedback voltage reference of the regula- tor, and v track is 0.6 v. since r tb is equal to the 4.99k top feedback resistor of the slave regulator in equal slew rate or coincident tracking, then r ta is equal to r fb with v fb = v track . therefore r tb = 4.99 k, and r ta = 4.99 k in figure 5. in ratiometric tracking, a different slew rate maybe desired for the slave regulator. r tb can be solved for when sr is slower than mr. make sure that the slave supply slew rate is chosen to be fast enough so that the slave output voltage will reach its final value before the master output. for example, mr = 1.5 v/ms, and sr = 1.2 v/ms. then r tb = 6.19k. solve for r ta to equal 4.22k. for applications that do not require tracking or sequenc- ing, simply tie the track/ss pin to intv cc to let run control the turn on/off. when the run pin is below its threshold or the v in undervoltage lockout, then track/ss is pulled low. default overcurrent and overvoltage protection the ltm4636 has overcurrent protection ( ocp) in a short circuit. the internal current comparator threshold folds back during a short to reduce the output current. an over voltage condition ( ovp) above 10% of the regulated output voltage will force the top mosfet off and the bottom mosfet on until the condition is cleared. foldback current limiting is disabled during soft-start or tracking start-up. temperature monitoring measuring the absolute temperature of a diode is pos - sible due to the relationship between current, voltage and temperature described by the classic diode equation: i d = i s ? e v d ? v t ? ? ? ? ? ? or v d = ? v t ? in i d i s where i d is the diode current, v d is the diode voltage, is the ideality factor ( typically close to 1.0) and i s (satura- tion current ) is a process dependent parameter. v t can be broken out to: v t = k ? t q where t is the diode junction temperature in kelvin, q is the electron charge and k is boltzmanns constant. v t is approximately 26 mv at room temperature (298 k) and scales linearly with kelvin temperature. it is this linear temperature relationship that makes diodes suitable tem - perature sensors . the i s term in the previous equation is the extrapolated current through a diode junction when the diode has zero volts across the terminals. the i s term varies from process to process, varies with temperature, and by definition must always be less than i d . combining all of the constants into one term: k d = ? k q where k d = 8.62 ?5 , and knowing ln(i d /i s ) is always posi- tive because i d is always greater than i s , leaves us with the equation that: v d = t kelvin ( ) ? k d ? in i d i s ltm4636 4636f
18 for more information www.linear.com/ltm4636 where v d appears to increase with temperature. it is com- mon knowledge that a silicon diode biased with a current source has an approximate C2 mv/c temperature rela- tionship (figure 7), which is at odds with the equation. in fact, the i s term increases with temperature, reducing the ln(i d /i s ) absolute value yielding an approximate C2mv/c composite diode voltage slope. a pplica t ions i n f or m a t ion to obtain a linear voltage proportional to temperature we cancel the i s variable in the natural logarithm term to remove the i s dependency from the equation 1. this is accomplished by measuring the diode voltage at two cur- rents i 1 , and i 2 , where i 1 = 10 ? i 2 ) and subtracting we get: ?v d = t(kelvin) ? k d ? in i 1 i s C t(kelvin) ? k d ? in i 2 i s combining like terms, then simplifying the natural log terms yields: ? v d = t(kelvin ) ? k d ? ln(10) and redefining constant k' d = k d ? in(10) = 198v k yields ? v d = k' d ? t(kelvin) figure 7. diode voltage v d vs temperature t(c) temperature (c) ?50 ?25 0.3 diode voltage (v) 0.5 0.8 0 50 75 0.4 0.7 0.6 25 100 4636 f07 125 solving for temperature: t(kelvin) = ?v d k' d ( celsius) = t(kelvin)C 273.15 where 300 k = 27c means that is we take the difference in voltage across the diode measured at two currents with a ratio of 10, the resulting voltage is 198 v per kelvin of the junction with a zero intercept at 0 kelvin. the diode connected npn transistor at the temp pin can be used to monitor the internal temperature of the ltm4636. figure 8. the tw o images show the ltm4636 operating at 1v at 40a and 3.3v at 35a from a 12v input. both images reflect only a 40c to 45c rise above ambient at full load current with 200lfm. 8b. 8a. v in v out i out air flow 12 1 40 200 lfm v in v out i out air flow 12 3.3 35 200 lfm ltm4636 4636f
19 for more information www.linear.com/ltm4636 a pplica t ions i n f or m a t ion overtemperature protection the ltm4636 has an overtemperature enhanced protec- tion features that can be used to detect overtemperature. the overtemperature feature uses the tmon pin voltage to monitor temperature. this pin varies from 0.994 v at 25c to 1.494 at 150 c, and will tripoff at 150 c. tying tmon to ground disable this feature. runp and runc enable the runp pin is used to enable the 5v pv cc supply that powers the power driver stage and enables the power stage ~1 ms later. the runc pin is used to enable the control section that drives the power stage. the runp needs to be enabled first, and then runc. runp has a 0.85v threshold and can be connected to the input volt - age and runc has a 1.35 v threshold and a 10 k resistor to ground. see the block diagram for details. a 0.1 f capacitor from the runc pin to ground is used to set the delay for runc enable. intv cc and pv cc regulators the ltm4636 has an internal low dropout regulator from v in called intv cc . this regulator output has a 4.7 f ceramic capacitor internal. this regulator powers the control section. the pv cc 5 v regulator supplies power to the power mosfet driver stage. an additional 50ma can be used from this 5 v pv cc supply for other needs. the input supply source resistance needs to be very low in order to minimize ir drops when operating from a 5v input source. depending on the output voltage and current, the input supply can source large current,and pv cc 5v regulator needs a minimum 4.70 v supply. additional input capacitance maybe needed for 5 v inputs to limit the input droop. stability compensation the ltm4636 has already been internally compensated when compb is tied to compa for all output voltages. table 5 is provided for most application requirements. for specific optimized requirements, disconnect compb from compa, and use ltpowercad to perform specific control loop optimization. then select the desired external compensation and output capacitance for the desired optimized response. sw pins the sw pins are generally for testing purposes by moni - toring these pins. these pins can also be used to dampen out switch node ringing caused by lc parasitic in the switched current paths. usually a series r-c combina - tion is used called a snubber circuit. the resistor will dampen the resonance and the capacitor is chosen to only affect the high frequency ringing across the resistor. if the stray inductance or capacitance can be measured or approximated then a somewhat analytical technique can be used to select the snubber values. the inductance is usually easier to predict. it combines the power path board inductance in combination with the mosfet interconnect bond wire inductance. first the sw pin can be monitored with a wide bandwidth scope with a high frequency scope probe. the ring fre - quency can be measured for its value. the impedance z can be calculated: z(l) = 2fl, where f is the resonant frequency of the ring, and l is the total parasitic inductance in the switch path. if a resistor is selected that is equal to z, then the ringing should be dampened. the snubber capacitor value is chosen so that its impedance is equal to the resistor at the ring frequency. calculated by: z(c ) = 1/(2fc). these values are a good place to start with. modification to these components should be made to attenuate the ringing with the least amount of power loss. a recommended value of 2.2 in series with 2200 pf to ground should work for most ap - plications. see figure 19 for guideline. the 2.2 resistor should be an 0805 size. thermal considerations and output current derating the thermal resistances reported in the pin configuration section of the data sheet are consistent with those param- eters defined by jesd51-12 and are intended for use with finite element analysis ( fea) software modeling tools that leverage the outcome of thermal modeling, simulation, and correlation to hardware evaluation performed on a module package mounted to a hardware test board. the motivation for providing these thermal coefficients in found in jesd 51-12 ( guidelines for reporting and using electronic package thermal information). ltm4636 4636f
20 for more information www.linear.com/ltm4636 a pplica t ions i n f or m a t ion many designers may opt to use laboratory equipment and a test vehicle such as the demo board to predict the module regulators thermal performance in their application at various electrical and environmental operating conditions to compliment any fea activities. without fea software, the thermal resistances reported in the pin configuration section are, in and of themselves, not relevant to providing guidance of thermal performance; instead, the derating curves provided in this data sheet can be used in a man - ner that yields insight and guidance pertaining to ones application usage, and can be adapted to correlate thermal performance to ones own application. the pin configuration section gives four thermal coeffi - cients explicitly defined in jesd51-12; these coefficients are quoted or paraphrased below: 1. ja , the thermal resistance from junction to ambient, is the natural convection junction-to-ambient air thermal resistance measured in a one cubic foot sealed enclo - sure. this environment is sometimes referred to as still air although natural convection causes the air to move. this value is determined with the part mounted to a 95mm 76mm pcb with four layers. 2. jcbottom , the thermal resistance from junction to the bottom of the product case, is determined with all of the component power dissipation flowing through the bottom of the package. in the typical module regulator, the bulk of the heat flows out the bottom of the pack - age, but there is always heat flow out into the ambient environment. as a result, this thermal resistance value may be useful for comparing packages but the test conditions dont generally match the users application. 3 jctop , the thermal resistance from junction to top of the product case, is determined with nearly all of the component power dissipation flowing through the top of the package. as the electrical connections of the typical module regulator are on the bottom of the package, it is rare for an application to operate such that most of the heat flows from the junction to the top of the part . as in the case of jcbottom , this value may be useful for comparing packages but the test conditions dont generally match the users application. 4 jb , the thermal resistance from junction to the printed circuit board, is the junction- to- board thermal resistance where almost all of the heat flows through the bottom of the module package and into the board, and is really the sum of the jcbottom and the thermal resistance of the bottom of the part through the solder joints and a portion of the board. the board temperature is measured a specified distance from the package. a graphical representation of the aforementioned ther - mal resistances is given in figure 9; blue resistances are contained within the module regulator, whereas green resistances are external to the module package. figure 9. graphical representation of jesd51-12 thermal coefficients 4637 f09 module device junction-to-case (top) resistance junction-to-board resistance junction-to-ambient thermal resistance components case (top)-to-ambient resistance board-to-ambient resistance junction-to-case (bottom) resistance junction a t case (bottom)-to-board resistance ltm4636 4636f
21 for more information www.linear.com/ltm4636 a pplica t ions i n f or m a t ion as a practical matter, it should be clear to the reader that no individual or sub-group of the four thermal resistance parameters defined by jesd51-12 or provided in the pin configuration section replicates or conveys normal op - erating conditions of a module regulator. for example, in normal board-mounted applications, never does 100% of the devices total power loss ( heat) thermally con- duct exclusively through the top or exclusively through the bottom of the module packageas the standard defines for jctop and jcbottom , respectively. in practice, power loss is thermally dissipated in both directions away from the packagegranted, in the absence of a heat sink and airflow, a majority of the heat flow is into the board. within the ltm4636, be aware there are multiple power devices and components dissipating power, with a con - sequence that the thermal resistances relative to different junctions of components or die are not exactly linear with respect to total package power loss. to reconcile this complication without sacrificing modeling simplicity but also not ignoring practical realitiesan approach has been taken using fea software modeling along with laboratory testing in a controlled-environment chamber to reason - ably define and correlate the thermal resistance values supplied in this data sheet : (1) initially, fea software is used to accurately build the mechanical geometry of the ltm4636 and the specified pcb with all of the correct material coefficients along with accurate power loss source definitions; (2) this model simulates a software-defined jedec environment consistent with jesd51-12 to predict power loss heat flow and temperature readings at different interfaces that enable the calculation of the jedec-defined thermal resistance values ; (3) the model and fea software is used to evaluate the ltm4636 with heat sink and airflow; (4) having solved for and analyzed these thermal resis - tance values and simulated various operating conditions in the software model, a thorough laboratory evaluation replicates the simulated conditions with thermocouples within a controlled-environment chamber while operat - ing the device at the same power loss as that which was simulated. the outcome of this process and due diligence yields the set of derating curves shown in this data sheet. the power loss curves in figures 10 to 12 can be used in coordination with the load current derating curves in figures 13 to 18 for calculating an approximate ja thermal resistance for the ltm 463 6 with various airflow conditions . t he p ower loss curves are taken at room temperature and can be increased with a multiplicative factor according to the junction temperature , which is ~1.4 for 120 c. the derating curves are plotted with the output current starting at 40 a and the ambient temperature increased . the output voltages are 1 v, 2.5 v and 3.3 v. these are chosen to include the lower , middle and higher output voltage ranges for correlating the thermal resistance . thermal models are derived from several temperature measurements in a controlled temperature chamber along with thermal modeling analysis . the junction temperatures are monitored while ambient temperature is increased with and without airflow . the p ower lo ss increase with ambient temperature change is factored into the derating curves . the junctions are maintained at ~125 c maximum while lowering output current or power with increasing ambient temperature . the decreased output current will decrease the internal module loss as ambient temperature is increased . the monitored j unction temperature of 125 c minus the ambient operating temperature specifies how much module temperature rise can be allowed . as an example , in figure 14 the l oad current is derated to ~30 a at ~94 c with no air flow and the power loss for the 12 v to 1.0 v at 30 a output is a bout 4.2 w. the 4.2 w loss is calculated with the ~3 w room temperature loss from the 12 v to 1.0 v power loss curve at 30 a, and the 1.4 multiplying factor at 125 c junction . if the 94 c ambient temperature is subtracted from the 125 c junction temperature , then the difference of 31 c divided by 4.2 w equals a 7. 4 c/w ja thermal resistance . table 2 specifies a 7. 2 c/w value which is very close. tables 2, 3, and 4 provide equivalent thermal resistances for 1 v , 1.5 v and 3.3 v outputs with and without airflow and heat sinking . the derived thermal resistances in tables 2 thru 4 for the various conditions can be multiplied by the calculated power loss as a function of ambient temperature to derive temperature rise above ltm4636 4636f
22 for more information www.linear.com/ltm4636 ambient temperature (c) 0 load current (a) 45 35 25 40 30 20 15 10 5 0 60 120 4636 f13 4020 80 100 0lfm 200lfm 400lfm 0 45 35 25 40 30 20 15 10 5 0 60 120 4636 f14 4020 80 100 0lfm 200lfm 400lfm ambient temperature (c) load current (a) 0 45 35 25 40 30 20 15 10 5 0 60 120 4636 f15 4020 80 100 0lfm 200lfm 400lfm ambient temperature (c) load current (a) 0 45 35 25 40 30 20 15 10 5 0 60 120 4636 f16 4020 80 100 0lfm 200lfm 400lfm ambient temperature (c) load current (a) 0 45 35 25 40 30 20 15 10 5 0 60 120 4636 f17 4020 80 100 0lfm 200lfm 400lfm ambient temperature (c) load current (a) 0 45 35 25 40 30 20 15 10 5 0 60 120 4636 f18 4020 80 100 0lfm 200lfm 400lfm ambient temperature (c) load current (a) figure 13. 5v in , 1v out derate curve a pplica t ions i n f or m a t ion figure 15. 5v in , 1.5v out derate curve figure 14. 12v in , 1v out derate curve figure 10. 5v input power loss curves figure 11.8v input power loss curves figure 12. 12v input power loss curves output current (a) 0 watts (w) 8 5 3 6 7 4 2 1 0 25 15 4035 4636 f10 20 105 30 3.3v out , 500khz 2.5v out , 500khz 1.8v out , 450khz 1.5v out , 425khz 1.2v out , 300khz 1v out , 300khz output current (a) 0 watts (w) 8 5 3 6 7 4 2 1 0 25 15 4035 4636 f11 20 105 30 3.3v out , 700khz 2.5v out , 600khz 1.8v out , 500khz 1.5v out , 450khz 1.2v out , 400khz 1v out , 350khz output current (a) 0 watts (w) 7 5 3 6 4 2 1 0 25 15 40 4636 f12 20 105 30 35 3.3v out , 750khz 2.5v out , 650khz 1.8v out , 600khz 1.5v out , 550khz 1v out , 350khz figure 16. 12v in , 1.5v out derate curve figure 17. 5v in , 3.3v out derate curve figure 18. 12v in , 3.3v out derate curve ltm4636 4636f
23 for more information www.linear.com/ltm4636 table 2. 1 v output derating curve v in power loss curve airflow ( lfm ) ja ( c/w) figures 13, 14 5v , 12 v figure 10, 12 0 7. 2 figures 13, 14 5v , 12 v figure 10, 12 200 5.4 figures 13, 14 5v , 12 v figure 10, 12 400 4.8 table 3. 1.5 v output derating curve v in power loss curve airflow ( lfm ) ja ( c/w) figures 15, 16 5v , 12 v figure 10, 12 0 7.4 figures 15, 16 5v , 12 v figure 10, 12 200 5.0 figures 15, 16 5v , 12 v figure 10, 12 400 4.5 table 4. 3.3 v derating curve v in power loss curve airflow ( lfm ) ja ( c/w) figures 17, 18 12 v figure 10, 12 0 7.4 figures 17, 18 12 v figure 10, 12 200 5.0 figures 17, 18 12 v figure 10, 12 400 4.4 a pplica t ions i n f or m a t ion table 5. ltm4636 capacitor matrix, all below parameters are typical and are dependent on board layout taiyo yuden 22f, 25v c3216x7s0j226m panasonic sp 470f 2.5v eefgx0e471r sanyo 20sep100m 100f 20v murata 22f, 25v grm31cr61c226ke15l sanyo poscap 470f 2r5 2r5tpd470m5 murata 100f, 6.3v grm32er60j107m sanyo poscap 470f 6.3v 6tpd470m5 avx 100f, 6.3v 18126d107 mat taiyo yuden 220f, 4v murata 220f, 4v ltm4636 4636f
24 for more information www.linear.com/ltm4636 a pplica t ions i n f or m a t ion table 6. enhanced external compensation, lower voltage transition during transient. careful power integrity layout required v out (v) c in ( ceramic) c in (bulk) ? c out1 (ceramic) and c out2 ( ceramic and bulk) c ff (pf) c comp (pf) v in (v) droop (mv) peak-to-peak deviation (mv) recovery time (s) load step (a/s) r fb (k) freq (khz) r comp (k) c comp (pf) 0.9 22f 5 100f 220f 10, 470f 47 100 5, 12 25 50 26 15 10 350 15k 1000 1 22f 5 100f 220f 10, 470f 47 100 5, 12 28 55 25 15 7.5 350 15k 1000 1.2 22f 5 100f 220f 10, 470f 47 100 5, 12 33 66 30 15 4.99 350 15k 1000 ? bulk capacitance is optional if v in has very low input impedance. c ff is a capacitor from v out to v fb pin. v out (v) c in ( ceramic) c in (bulk) c out1 (ceramic) and c out2 (ceramic and bulk) c ff (pf) c comp (pf) v in (v) droop (mv) peak-to-peak deviation (mv) recovery time (s) load step (a/s) r fb (k) freq (khz) 0.9 22f 5 100f 100f 8, 470f 3 22 100 5,12 38 76 40 15 10 350 0.9 22f 5 100f 220f 6, 470f 2 68 100 5,12 40 80 30 15 10 350 0.9 22f 5 100f 220f 10, 470f none 220 5,12 40 80 30 15 10 350 1 22f 5 100f 100f 4, 470f 3 none 100 5,12 40 80 30 15 7.5 350 1 22f 5 100f 100f 6, 470f 2 none 100 5,12 50 100 30 15 7.5 350 1 22f 5 100f 100f 8, 470f 2 none 150 5,12 55 105 30 15 7.5 350 1.2 22f 5 100f 100f 4, 470f 3 none 100 5,12 45 90 35 15 4.99 350 1.2 22f 5 100f 100f 6, 470f 2 none 100 5,12 45 90 35 15 4.99 400 1.2 22f 5 100f 220f 4, 470f none 100 5,12 50 104 30 15 4.99 400 1.5 22f 5 100f 100f 4, 470f 3 none 100 5,12 60 120 35 15 3.32 425 1.5 22f 5 100f 100f 4, 470f 2 none 100 5,12 56 110 35 15 3.32 425 1.5 22f 5 100f 100f 3, 470f none 100 5,12 75 150 25 15 3.32 425 1.8 22 f 5 100f 100f 3, 470f none 220 5,12 90 180 25 15 2.49 500 1.8 22f 5 100f 100f, 470f none 220 5,12 95 197 24 15 2.49 500 1.8 22f 5 100f 220f 2, 470f none 220 5,12 90 180 20 15 2.49 500 2.5 22f 5 100f 100f 2, 470f none 220 5,12 120 220 30 15 1.58 650 (12v) 500 (5v) 2.5 22 f 5 100f 100f 6, 470f 22 220 5,12 87 174 40 15 1.58 650 (12v) 500 (5v) 3.3 22 f 5 100f 100f 4 220 220 5,12 130 260 25 15 1.1 750 (12v) 500 (5v) 3.3 22 f 5 100f 100f, 470f none 220 5,12 140 280 30 15 1.1 750 (12v) 500 (5v) ltm4636 4636f
25 for more information www.linear.com/ltm4636 a pplica t ions i n f or m a t ion ambient , thus maximum junction temperature . room temperature power loss curves are provided in figures 10 through 12. the printed circuit board is a 1.6 mm thick six layer board with two ounce copper for all layers and one ounce copper for the two inner layers . the pcb dimensions are 95 mm 76 mm . safety considerations the ltm 4636 does not provide galvanic isolation from v in to v out . there is no internal fuse . if required , a slow blow fuse with a rating twice the maximum input current needs to be provided to protect each unit from catastrophic failure . the fuse or circuit breaker should be selected to limit the current to the regulator during overvoltage in case of an internal top mosfet fault . if the internal top mosfet fails , then turning it off will not resolve the overvoltage , thus the internal bottom mosfet will turn on indefinitely trying to protect the load . under this fault condition , the input voltage will source very large currents to ground through the failed internal top mosfet and enabled internal bottom mosfet. this can cause excessive heat and board damage depending on how much power the input voltage can deliver to this system . a fuse or circuit breaker c an be us ed as a secondary fault protector in this situation . the ltm 4636 has the enhanced over temperature protection discussed earlier and schematic applications will be shown at the end of the data sheet . layout checklist/example the high integration of the ltm 4636 makes the pcb board layout very simple and easy . however , to optimize its electrical and thermal performance , some layout considerations are still necessary . ? use large pcb copper areas for high current paths , including v in , gnd and v out . it helps to minimize the pcb conduction loss and thermal stress . ? place high frequency ceramic input and output capacitors next to the v in , gnd and v out pins to minimize high frequency noise . ? place a dedicated power ground layer underneath the unit . ? to minimize the via conduction loss and reduce module thermal stress , use multiple vias for interconnection between top layer and other power layers . ? do not put vias directly on the pad , unless they are capped or plated over . ? place test points on signal pins for testing. ? use a separated sgnd ground copper area for components connected to signal pins . connect the sgnd to gnd underneath the unit . ? for parallel modules , tie the comp a nd v fb pins together . use an internal layer to closely connect these pins together . ? r snub and c snub (2.2 and 2200 pf ) values to dampen switch ringing . figure 19 gives a good example of the recommended layout . ltm4636 4636f
26 for more information www.linear.com/ltm4636 a pplica t ions i n f or m a t ion figure 19. recommended pcb layout 1 m l k j h g f e d c b a 2 3 4 5 6 7 v out v out c out1 c in2 c in1 c in4 c in3 c out2 r runc v out gnd temp sense gnd gnd 4636 f19 v in gnd 8 9 10 11 12 c out3 c out4 c run c tk/ss r fb p vcc cap r freq r snub 0805 c snub 0603 ltm4636 4636f
27 for more information www.linear.com/ltm4636 figure 20. 4.70 v to 15 v, 1v at 40 a design typical a pplica t ions + compa compb tk/ss runc runp hizreg freq mode/pllin sw v out temp + temp ? snsp1 snsp2 sgnd v in 5v pv cc 100pf 5v pv cc 34.8k sgnd sgnd sgnd c ss 0.1f 22f 1v at 40a 2.2, 0805 0.1f 4.70v to 14v 100f 25v 22f 16v 5 intv cc optional temp monitor intv cc intv cc ltm4636 pv cc pgnd v outs1 + v outs1 ? v fb + 470f 6.3v 470f 6.3v + + 470f 6.3v r fb2 7.5k 100f 4 6.3v 4636 f20 pins not used in circuit ltm4636: clkout, gmon, pgood, phmode, pwm, test1, test2, test3, test4, tmon 15k 2200pf v in 5.5v, tie v in , intv cc and pv cc together, tie runp to gnd. v in > 5.5v, then operate as shown ltm4636 4636f
28 for more information www.linear.com/ltm4636 typical a pplica t ions figure 21. 2- phase 1v, 80a regulator design 7.5k 0.47f 34.8k 4.70v to 15v 4.70v to 15v ++ compa compb tk/ss runc runp hizreg freq mode/pllin sw temp + temp ? snsp1 snsp2 sgnd v in 34.8k clk intv cc2 22f 1v 80a 22f 16v 4 c ss 0.22f comp 5v, pv cc2 tk/ss runc runp optional temp monitor for telemetry readback ics intv cc intv cc2 5v pv cc2 u2 ltm4636 pv cc pgnd v outs1 + v out v outs1 ? v fb v fb r fb2 7.5k 4636 f21 tmon voltage out temp monitor 470f 6.3v 470f 6.3v 100f 6.3v 4 + compa compb tk/ss runc runp hizreg phmode freq mode/pllin clkout tmon sw v out temp + temp ? snsp1 snsp2 sgnd v in 22f 2200pf voltage out temp monitor 2.2, 0805 22f 16v 4 v in 5.5v, tie v in , intv cc and pv cc together, tie runp to gnd. v in > 5.5v, then operate as shown intv cc1 runc runp clk comp tk/ss optional temp monitor for telemetry readback ics intv cc intv cc1 5v pv cc1 u1 ltm4636 pv cc pgnd v outs1 ? v fb v fb intv cc1 470f 6.3v + 470f 6.3v + 100f 25v 100f 6.3v 4 pins not used in circuit ltm4636 u1: gmon, pgood, pwm, test1, test2, test3, test4, v osns1 pins not used in circuit ltm4636 u2: gmon, pgood, phmode, pwm, test1, test2, test3, test4 2200pf 2.2, 0805 sgnd sgnd sgnd sgnd sgnd 100pf ltm4636 4636f
29 for more information www.linear.com/ltm4636 typical a pplica t ions figure 22. 3- phase 0.9 v at 120 a with protection + compa compb tk/ss runc runp hizreg freq mode/pllin clkout tmon sw v out temp + temp ? snsp1 snsp2 sgnd v in 34.8k 22f voltage out temp monitor 22f 16v 3 7v to 12v intv cc1 runc runp clk comp tk/ss optional temp monitor for telemetry readback ics intv cc intv cc1 5v pv cc1 u1 ltm4636 pv cc pgnd v fb v fb 470f 6.3v + 470f 6.3v + 100f 25v 100f 6.3v 3 v outs1 ? v outs1 ? 2.2, 0805 2200pf 4.99k 0.47f + compa compb tk/ss runc runp hizreg freq mode/pllin clkout tmon sw v outs1 + v out temp + temp ? snsp1 snsp2 sgnd v in 0.9v at 120a clk clk1 intv cc2 22f voltage out temp monitor 34.8k c ss 0.22f 22f 16v 3 comp tk/ss runc runp optional temp monitor for telemetry readback ics intv cc intv cc2 5v pv cc2 u2 ltm4636 pv cc pgnd v outs1 ? v fb v fb 4636 f22 470f 6.3v + 470f 6.3v r fb3 10k 100f 6.3v 3 100f + compa compb tk/ss runc runp hizreg freq mode/pllin tmon sw v out temp + temp ? snsp1 snsp2 sgnd v in 34.8k 22f voltage out temp monitor 22f 16v 3 intv cc3 runc runp clk1 comp tk/ss optional temp monitor for telemetry readback ics intv cc intv cc3 5v pv cc3 u3 ltm4636 pv cc pgnd v fb v fb 470f 6.3v + 470f 6.3v + 100f 25v 100f 6.3v 3 v outs1 ? v outs1 ? pins not used in circuit ltm4636 u1: gmon , pgood, phmode, pwm, test1, test2, test3, test4, v outs1 pins not used in circuit ltm4636 u2: gmon , pgood, phmode, pwm, test1, test2, test3, test4 pins not used in circuit ltm4636 u3: gmon , pgood, phmode, pwm, test1, test2, test3, test4, v outs1 , clkout 2.2, 0805 2200pf 2.2, 0805 2200pf sgnd sgnd sgnd sgnd sgnd sgnd sgnd 100pf ltm4636 4636f
30 for more information www.linear.com/ltm4636 typical a pplica t ions figure 24. thermal plot , 12 v to 0.9 v at 120 a, 400 lfm air flow figure 23. demo board figure 25. efficiency , 12 v to 0.9 v at 120 a figure 26. 12 v to 0.9 v 30 a / s load step 4636 f24 4636 f23 load current (a) 0 efficiency (%) 95 85 75 90 80 70 65 60 50 60 70 90 100 110 4020 30 80 4636 f25 120 10 4636 f26 v out 40mv droop 30a/s step internal compensation c out = 6x 470f 6v tpd pos cap, 12 100f ceramic further optimization can be utilized with external comp ltm4636 4636f
31 for more information www.linear.com/ltm4636 typical a pplica t ions figure 2 7. four phase 0.9 v at 160 a design + compa compb tk/ss runc runp hizreg phmode freq mode/pllin clkout tmon pwm sw v out temp + temp ? snsp1 snsp2 sgnd v in 34.8k 22f voltage out temp monitor 22f 16v 22f 16v 22f 16v 22f 16v 150f 35v 7v to 14v 12v 12v 12v intv cc2 runc runp clk2 clk1 comp tk/ss optional temp monitor for telemetry readback ics intv cc intv cc2 5v pv cc2 u2 ltm4636 pv cc pgnd v fb v outs1 ? v fb power gnd pwm2 tp 470f 6.3v + 470f 6.3v 100f 6.3v 4 gnd_sns 2.2, 0805 2200pf 2200pf 4636 f27 v out + compa compb tk/ss runc runp hizreg tmon pwm sw v out temp + temp ? snsp1 snsp2 sgnd v in 34.8k 4.99k 5v pv cc1 22f voltage out temp monitor c ss 0.47f 0.47f intv cc1 runc runp clk1 comp tk/ss optional temp monitor for telemetry readback ics intv cc intv cc1 5v pv cc1 u1 ltm4636 pv cc pgnd v fb v fb pwm1 tp 470f 6.3v r fb 2.5k + 470f 6.3v 100f 6.3v 4 v outs1 ? v outs1 + 2.2, 0805 0.9v at 160a + compa compb tk/ss runc runp hizreg phmode freq mode/pllin clkout tmon pwm sw v out temp + temp ? snsp1 snsp2 sgnd v in 34.8k 22f gnd_sns voltage out temp monitor intv cc3 runc runp clk3 clk2 tk/ss comp optional temp monitor for telemetry readback ics pins not used in circuit u2: pgood, test1, test2, test3, test4, v outs1 , gmon pins not used in circuit u1: pgood, test1, test2, test3, test4, gmon pins not used in circuit u3: pgood, test1, test2, test3, test4, v outs1 , gmon pins not used in circuit u4: pgood, test1, test2, test3, test4, v outs1 , gmon intv cc intv cc3 5v pv cc3 u3 ltm4636 pv cc pgnd v fb v fb pwm3 tp 470f 6.3v + 470f 6.3v 100f 6.3v 4 gnd_sns 2.2, 0805 2200pf + compa compb tk/ss runc runp hizreg phmode freq mode/pllin tmon pwm sw v out temp + temp ? snsp1 snsp2 sgnd v in 34.8k 22f voltage out temp monitor intv cc4 runc runp clk3 comp tk/ss optional temp monitor for telemetry readback ics intv cc intv cc4 5v pv cc4 u4 ltm4636 pv cc pgnd v fb v outs1 ? v fb pwm4 tp 470f 6.3v + 470f 6.3v 100f 6.3v 4 gnd_sns 2.2, 0805 2200pf 100pf v outs1 ? + 22f 16v 22f 16v 22f 16v 22f 16v 22f 16v 22f 16v 22f 16v 22f 16v 22f 16v 22f 16v 22f 16v 22f 16v phmode freq mode/pllin clkout sgnd sgnd sgnd sgnd sgnd sgnd sgnd sgnd sgnd sgnd sgnd sgnd sgnd sgnd sgnd ltm4636 4636f
32 for more information www.linear.com/ltm4636 figure 30. efficiency , 12 v to 0.9 v at 160 a figure 31. 12 to 0.9 v 30 a / s load step typical a pplica t ions figure 29. thermal plot , 12 v to 0.9 v at 160 a, 400 lfm air flow figure 28. dc 2448 a demo board 4636 f29 4636 f28 load current (a) 0 efficiency (%) 95 85 75 90 80 70 65 60 60 100 4020 80 4636 f30 160 120 140 4636 f31 v out 31mv droop 30a/s step internal compensation c out = 8x 470f 6v tpd pos cap, 16 100f ceramic further optimization can be utilized with external comp ltm4636 4636f
33 for more information www.linear.com/ltm4636 pin id function pin id function pin id function pin id function pin id function pin id function a1 v out b1 v out c1 v out d1 v out e1 pgood f1 snsp2 a2 v out b2 v out c2 v out d2 v out e2 runc f2 snsp1 a3 v out b3 v out c3 v out d3 v outs1 C e3 track/ss f3 hizreg a4 v out b4 v out c4 v out d4 v outs1 + e4 v fb f4 sgnd a5 v out b5 v out c5 v out d5 compb e5 compa f5 test2 a6 v out b6 v out c6 v out d6 gnd e6 gnd f6 intv cc a7 v out b7 v out c7 v out d7 gnd e7 gnd f7 gnd a8 v out b8 v out c8 v out d8 gnd e8 gnd f8 gnd a9 v out b9 v out c9 v out d9 gnd e9 gnd f9 pv cc a10 v out b10 v out c10 v out d10 gnd e10 gnd f10 gnd a11 v out b11 v out c11 v out d11 v out e11 test 4 f11 gnd a12 v out b12 v out c12 v out d12 v out e12 gnd f12 gnd pin id function pin id function pin id function pin id function pin id function pin id function g1 gnd h1 gnd j1 gnd k1 gnd l1 gnd m1 gnd g2 gnd h2 test3 j2 gnd k2 gnd l2 gnd m2 gnd g3 clkout h3 mode/pllin j3 gnd k3 gnd l3 gnd m3 gnd g4 sgnd h4 test1 j4 v in k4 v in l4 v in m4 v in g5 freq h5 v in j5 v in k5 v in l5 v in m5 v in g6 gnd h6 v in j6 v in k6 v in l6 v in m6 v in g7 phasmd h7 pwm j7 v in k7 v in l7 v in m7 v in g8 runp h8 tmon j8 gnd k8 v in l8 v in m8 v in g9 nc h9 gmon j9 gnd k9 gnd l9 gnd m9 gnd g10 gnd h10 gnd j10 gnd k10 gnd l10 gnd m10 gnd g11 temp C h11 gnd j11 gnd k11 sw l11 sw m11 gnd g12 temp + h12 gnd j12 gnd k12 gnd l12 gnd m12 gnd p ackage descrip t ion pin assignment table (arranged by pin number) package row and column labeling m ay vary among module products. review each package layout carefully. ltm4636 4636f
34 for more information www.linear.com/ltm4636 p ackage descrip t ion p ackage p ho t o v out v out v out v out v out v out pgood runc snsp2 snsp1 1 2 3 4 5 6 7 top view 8 9 10 11 12 m l k j h g f e d c b a compb test2 test4 gnd gnd intv cc pv cc phasmd runp temp ? temp + nc clkout sgnd sgnd v fb v outs1 + hizreg track/ss compa v outs1 ? freq pwm test3 mode/pllin test1 tmon gmon gnd gnd gnd gnd gnd gnd gnd v in v in v in v in v in gnd gnd gnd sw sw gnd ltm4636 4636f
35 for more information www.linear.com/ltm4636 information furnished by linear technology corporation is believed to be accurate and reliable. however, no responsibility is assumed for its use. linear technology corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. p ackage descrip t ion please refer to http://www .linear.com/product/ltm4636#packaging for the most recent package drawings. 4 pin ?a1? corner notes: 1. dimensioning and tolerancing per asme y14.5m-1994 2. all dimensions are in millimeters. drawing not to scale ball designation per jep95 4 3 details of pin #1 identifier are optional, but must be located within the zone indicated. the pin #1 identifier may be either a mold or marked feature package top view x y aaa z aaa z package bottom view 3 see notes suggested pcb layout top view bga 144 1016 rev d tray pin 1 bevel package in tray loading orientation component pin ?a1? detail a pin 1 0.0000 0.0000 detail a ?b (144 places) d (3.0) (2.4) (2.4) a detail b package side view z z m x yzddd m zeee 0.630 0.025 ? 144x e b e e b a2 f g bga package 144-lead (16mm 16mm 7.07mm) (reference ltc dwg # 05-08-1937 rev d) 0.6350 0.6350 1.9050 1.9050 3.1750 3.1750 4.4450 4.4450 5.7150 5.7150 6.9850 6.9850 6.9850 5.7150 5.7150 4.4450 4.4450 3.1750 3.1750 1.9050 1.9050 0.6350 0.6350 6.9850 g f e a b d c h m l k j 2 1 4 3 567 12 891011 7 see notes detail b substrate a1 ccc z // bbb z h2 h1 h3 symbol a a1 a2 b b1 d e e f g h1 h2 h3 aaa bbb ccc ddd eee min 6.57 0.50 2.31 0.60 0.60 0.36 1.95 3.76 nom 7.07 0.60 2.41 0.75 0.63 16.00 16.00 1.27 13.97 13.97 0.41 2.00 4.06 max 7.42 0.70 2.51 0.90 0.66 0.46 2.05 4.21 0.15 0.10 0.20 0.30 0.15 notes ball ht ball dimension pad dimension substrate thk mold cap ht inductor ht dimensions total number of balls: 144 epoxy/solder (11.20) (10.0) (3.0) module 5. primary datum -z- is seating plane 6. solder ball composition can be 96.5% sn/3.0% ag/0.5% cu or sn pb eutectic 7 package row and column labeling may vary among module products. review each package layout carefully ! b1 mold cap ltm4636 4636f
36 for more information www.linear.com/ltm4636 ? linear technology corporation 2016 lt 1216 ? printed in usa linear technology corporation 1630 mccarthy blvd., milpitas, ca 95035-7417 (408) 432-1900 fax : (408) 434-0507 www.linear.com/ltm4636 r ela t e d p ar t s design r esources typical a pplica t ion part number description comments ltm4650/ ltm4650-1 more current up to 50a module regulator dual 25a or single 50a, 4.5v v in 15v, 0.6v v out 1.8v, 16mm 16mm 5.01mm bga ltm 4630/ ltm4630-1/ ltm4630a less current up to 36a module regulator ltm4650 pin-compatible; same v in and v out range; ltm4630a 0.6v v out 5.3v, 16mm 16mm 4.41mm lga 5.01mm bga ltm 4647 smaller package up to 30a module regulator single 30a, 4.7v v in 15v, 0.6v v out 1.8v, 9mm 15mm 5.01mm bga 5v to 2.5v at 35a design subject description module design and manufacturing resources design: ? selector guides ? demo boards and gerber files ? free simulation tools manufacturing: ? quick start guide ? pcb design, assembly and manufacturing guidelines ? package and board level reliability module regulator products sear ch 1. sort table of products by parameters and download the result as a spread sheet. 2. search using the quick power sear ch parametric table. techclip videos quick videos detailing how to bench test electrical and thermal performance of module products. digital power system management linear technologys family of digital power supply management ics are highly integrated solutions that offer essential functions, including power supply monitoring, supervision, margining and sequencing, and feature eeprom for storing user configurations and fault logging. compa compb tk/ss runc runp hizreg freq mode/pllin tmon v out temp + temp ? snsp1 snsp2 sgnd v in 15k 47k c ss 0.1f 22f 2.5v at 35a voltage out temp monitor 0.1f 22f 16v 22f 16v 22f 16v 22f 16v 22f 16v 5v 100f 25v intv cc optional temp monitor for telemetry readback ics intv cc intv cc ltm4636 pv cc pgnd v outs1 + v outs1 ? v fb + 470f 4v 470f 4v + + r fb 1.58k 100f 3 6.3v c ff 47pf 4636 ta02 pins not used in circuit ltm4636: clkout , gmon, pgood, phmode, pwm, sw, test1, test2, test3, test4 sgnd sgnd sgnd ltm4636 4636f


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